Shenzhen Huayi Brother Technology Co., Ltd

 Semiconductor wafer cutting fluid

TUW-1320                        

Product Introduction

This product is suitable for cutting and cleaning semiconductor wafers and optoelectronic materials, focusing on reducing electrostatic accumulation and sawdust particle pollution in the process. The product has a light odor, good dirt dispersion ability, and anti-static ability. The particles after cutting will not adhere to the product, with excellent lubrication and cleaning effects, no corrosion to the workpiece, and is environmentally friendly.

Product parameters

Usage method

 1. The product is equipped with a dedicated liquid supply system for infusion into the cutting machine..

   2. If the foam is too large when cutting the wafer, please adjust the transmission frequency of the liquid supply system

Note

This product is an industrial chemical. If it accidentally splashes into the eyes, immediately rinse with clean water. If uncomfortable, seek medical attention.

Storage and Packaging 

1. Store in a sealed and cool environment at around 25 ℃.

2. Packaging specification: 1 gallon/barrel or 25kg/barrel.

3. Shelf life: 12 months.

  Disclaimer

The above information has been strictly tested by our company's technical personnel, and the provided data is cautious and reliable. However, it is not equivalent to the product achieving the same effect under any environmental conditions. Customers should determine the specific usage method based on their own environment and operational situation after actual trial use. If there is any impact or loss caused by improper customer operation, our company will not bear any responsibility.

Environmental policy

TUW will acknowledge and exercise the following responsibilities:

Eliminate the possibility of pollution from the source anytime, anywhere

Developing products with minimal environmental impact